Supporting the development of advanced semiconductor devices and packaging processes with a new university research laboratory

Penn State Microchip Research Cleanroom Facility

The Pennsylvania State University’s (Penn State’s) Department of Electrical Engineering needed a space where they could work with external research partners to develop advanced semiconductor devices and packaging processes. They engaged our team to help.

Located in Penn State’s Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), this cleanroom renovation includes the design of the new microelectronic systems packaging research laboratories. We are also assisting the University in determining the anticipated cost of construction for this effort.

The research has been divided into two distinct processes—wet material processing and dry packaging processes—and will be split between two buildings on campus. Our scope of work within each facility encompasses the fit out of new cleanroom space as well as modifications to existing space with minimal disruptions to existing research activities.

Wet material processing will be housed within an expansion of the existing H-Class cleanroom at Penn State’s Materials Research Institute within the Millennium Science Complex. Portions of their Electrical Engineering West facility will be updated to meet current design and research standards for the dry packaging processes suite.

When complete in the summer of 2026, these renovated and updated spaces will support Penn State and their partners in developing advanced semiconductor devices and packaging processes.